轴承加热器控制回路设计

文档编号:DQ069    文档字数:16384,页数:36

摘  要
 传统的轴承加热，以简单加热法最常见，利用感应加热法进行轴承的装配成为在过盈配合中使用最好的一种方法。与其他的加热方法相比较，感应式轴承加热器具有更多优点。轴承加热过程需要对其加热时间与温度进行较为精确的控制，因此需要设计一套相应的温度控制系统给予控制。本文设计的温度控制系统是以PIC 16F877单片机为控制核心。整个系统硬件部分包括温度检测系统、信号放大系统、A/D 转换、单片机、I/O 设备、控制执行系统等,具有检测并显示轴承温度，预设加热温度，LED显示加热状态（加热中与加热完成）功能。该温度控制系统具有处理能力强、运行速度快、功耗低等优点，控制简单方便，测量范围较广，精度较高。
 
关键词： 轴承加热器；单片机；控制回路，热敏电阻

Abstract
 In the traditional bearing assembly, heating is the most common method induction heating for bearing assembly is the best method in alignment. Compare to other heating methods, inductive bearing heater has more advantages. The heating time and temperature need more accurate  control in the bearing heating process, so we need to design a set of corresponding temperature control system to control. The temperature control system that designed in this paper takes microcontroller PIC16F877 as its control core. The entire system hardware parts include temperature testing system, amplification system, A/D conversion, SCM, I/O device, control system, etc, with the function including bearing temperature examination and display, heating temperature setting, heating condition display by LED(heating or heated). The temperature control system has advantages including strong handling ability , fast operation, low power consumption, simple and convenient control, wide range measure and high precision.
Keywords：bearing heater ; temperature ; single chip ;human-machine interface

目 录
摘要……………………………………………………………………………. . .….................П
Abstract………………………………………………………………………. . .……….........Ш
1 前言…………………………………………………………………………………………..1
2 总体设计方案……………………………………………………………………………. ..2
2.1 系统总体结构及指标要求……………………………………………………….........2
2.2系统的硬件示意图……………… ……………………………………………….........3
2.3 系统程序框图………………………………………………… ……… ………...... ...4
3 单片机的选取及其应用…………………………………………… …………................5
 3.1单片机的引脚示意图…………………………………………… ……………………5
 3.2 PIC16F877的数据存储器……………………………………… ……………………7
 3．3单片机的寄存器表……………………………………………………………………9
 3．4程序存储器的分页………………………………………………… … ……………10
 3.5CPU特性……………………………………………………………… …… …………10
 3.6 模/数转换器模块……………………………………………… …… ………………10
4 热敏电阻的选取    …………………...……...……...……...……...……...……...……13
 4.1温度传感器的种类……………………………………………………………………15
 4.2温度传感器的选取……………………………………………………………………15
 4.3 热电阻如何选型………………………………………………………………………15
5 控制回路的设计………………………………...………...………...……….............….17
 5.1控制回路的基本原理及分类…………………………………………………………17
 5.2控制回路的基本要求…………………………………………………………………17
 5.3控制回路的数据采集…………………………………………………………………18
 5.4 控制回路的键盘输入…………………………………………………………………19
6 结论……………………………………………………………………………………….....22
致谢………………………………………………………………………………………….....24
参考文献……………………………………………………………………………………....25
附录1……………………………………………………………………………………..........27

相关论文