智能型温控零电压开关 二

^论文字数:24610,页数:62  附任务书，开题报告，文献综述，原理图

摘  要
 摘要：介绍了以MCS-51数字信号处理器（CPU）为核心的智能型温度控制开关单元的硬件和软件设计。该系统集测量、保护、控制、通信、显示等功能于一体，实现了温控自动监控功能，硬件和软件均采用模块化设计。数字信号处理系统为测控单元的核心，文中对其信号调理、可编程逻辑、时钟、通信接口等功能模块化进行了介绍。软件设计中采用了新的数字滤波算法和保护算法，其总体采用实时多任务调度操作系统，并在主程序循环查询中断标志位的设计思路，将整个程序分为主程序 中断子程序两部分，最后给出主程序和部分中断子程序的流程图。
     关键词：智能化；模块化；数字信号处理器；；
 ABSTRACT: The design of measuring and controlling unit for intelligent breaker using MCS-51 Digital Signal Processor (CPU) is presented in which the measuring , protection ,control, communication and display are integrated, therefore , the microprocessor-based automation of breaker is implemented.  This unit also possesses the operation and grounding current leakage protection through monitoring the signals of currents and voltages. The modular design is applied to the software and hardware of the unit. As the kernel of measuring and controlling unit, in digital signal processing system the DSP is used and its functional modules, such as signal processing, CPLD, clock and communication interface, are described. In software design the new digital filtering algorithm and the protection algorithm are adopted, the real-time multitasking operation system is applied to the overall architecture and the interrupt flag bits are circularly retrieved in main program. The whole program is divided into two parts, i.e, the main program and the interruption subroutine. The flow chart of main program and partial interruption subroutines are given .The prototype of the unit is put into operation and the desired results are achieved.
    KEY WORDS:  Intelligence; Release； Moulded block；Protection algorithm；Hardware； Software

目   录
摘要………………………………………………………………………………………Ⅰ
Abstract………………………………………………………………………………………Ⅰ
第1章 概述………………………………………………………………………………1
 1.1课题名称及要求…………………………………………………………………1
    1.2 开关特性及特点……………………………………………………………1
 1.3 开关原理简述………………………………………………………………1
 1.4 设计思想……………………………………………………………………2
第2章 硬件设计……………………………………………………………………3
 2.1 晶闸管电路…………………………………………………………………3
 2.2 触发电路模块………………………………………………………………5
 2.3 集成温度传感器模块………………………………………………………6
 2.4 微处器模块电路…………………………………………………………10
第3章 软件设计……………………………………………………………………30
 3.1 系统定义…………………………………………………………………30
 3.2 软件结构设计……………………………………………………………31
 3.3 绘制程序流程图…………………………………………………………32
 3.4 编写程序…………………………………………………………………39
第4章 抗干扰………………………………………………………………………30
 4.1 干扰的来源………………………………………………………………30
 4.2 硬件抗干扰………………………………………………………………30
 4.3 软件抗干扰技术…………………………………………………………31
第5章 制作…………………………………………………………………………33
 5.1 印刷电路板………………………………………………………………33
 5.2 内外接线与安装…………………………………………………………37
 5.3 外壳………………………………………………………………………37
 5.4 元器件明细表……………………………………………………………37
 5.5 使用说明书………………………………………………………………37
结束语……………………………………………………………………………42
致  谢……………………………………………………………………………43
参考文献……………………………………………………………………………44
附录1………………………………………………………………………………45
附录2 ………………………………………………………………………………46
附录3 ………………………………………………………………………………57

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